Key Features
- Dual wiping modes, support needle‑type screw valve and flat‑nozzle piezo jet valve
- Optional solvent soaking module for enhanced cleaning performance for stubborn residues
- Industrial‑grade components, high reliability, improve production uptime
- Long‑spec cleaning tape, lower cost and less‑frequent replacement
- Low‑power standby mode, instant response upon trigger signal
- Wide compatibility: ultra‑fine needle to 2 mm large needle, jet‑valve nozzles
- Built‑in tape monitoring sensor, half‑material & no‑material alarm lamp and signal output
- Tool‑free tape roll replacement for quick maintenance
- Adjustable single step feed length of cleaning tape；solvent flow adjustable for wet‑type model
- Complete I/O functions: external trigger, manual tape advance, device ready signal, alarm output
Compatible Equipment
All kinds of screw dispensing valves and piezo jet valves, such as TD707A, TD908A, TD‑SE01‑X3, SPEN‑1K(X4), TPiz600.
Typical Applications
- SMT solder‑paste dispensing, remove solder paste residue on needles and nozzles
- Semiconductor & consumer‑electronics automatic dispensing production lines
- Automotive electronics, new‑energy power module dispensing stations
- Continuous mass production, periodic automatic wiping to stabilize dispensing consistency
Technical Specifications
| Parameter | Standard TW‑P / TW‑J | Solvent‑Wet TWR‑P / TWR‑J |
|---|---|---|
| Model | TW‑P / TW‑J | TWR‑P / TWR‑J |
| Weight | 1.9 kg | 2.2 kg |
| Dimension(L×H×W) | 193 × 147 × 53 mm | 253 × 147 × 90 mm |
| Cleaning Tape | W15 mm；15 m /35 m | W15 mm；15 m /35 m |
| Working Air Pressure | 0.3‑0.6 MPa | 0.3‑0.6 MPa |
| Power Supply | DC 24V | DC 24V |
| Applicable Object | Ultra‑fine needle ~2 mm needle, jet‑valve flat nozzle | Ultra‑fine needle ~2 mm needle, jet‑valve flat nozzle |
Why Choose TW Automatic Nozzle Wiping Unit
TW wiping unit is dedicated auxiliary device for automatic dispensing lines. It supports both needle‑style screw valves and flat‑nozzle jet valves. Tape remaining monitoring provides alarm output to host system. Tool‑free tape replacement shortens maintenance downtime. The optional solvent‑wet module solves cleaning difficulty for stubborn residues like solder paste. Linked with dispensing program by external I/O trigger, it completes periodic automatic wiping, effectively eliminate hanging glue and nozzle buildup, stabilize dot quality and reduce production defect rate.
