Key Features
- Reusable metal screw & fluid chamber, washable for repeated use, lower mass‑production cost
- Split‑type fluid‑cavity design to protect motor from glue contamination
- Quick replacement of screw and fluid‑chamber components, simple spare‑parts maintenance
- Adjustable motor rotation speed for flexible flow‑rate tuning
- Excellent dispensing repeatability, minimum dot diameter down to 0.15 mm
- Support dot dispensing and continuous line‑coating two processing modes
- Robust screw‑chamber assembly, low daily‑maintenance workload
- I/O signal and RS232 communication interface for automation system docking
- High‑speed cycle performance, over 400 dispensing cycles per minute
Compatible Materials
Solder paste, silver paste, SMT red glue, grease, UV adhesive, silicone and other medium‑high‑viscosity fluids with micro solid particles.
Typical Applications
- SMT micro solder‑paste dotting
- Epoxy resin & surface‑mount adhesive dispensing
- Structured glue‑bead formation
- Groove and cam cavity filling
- Chip bonding and precision electronic component assembly
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | TD908A |
| Dimension(W×L×H) | 38 mm × 94 mm × 196 mm |
| Valve Weight | 700 g |
| Fluid Inlet | Female Luer connector |
| Mounting Method | 25.4 mm hole or special valve bracket |
| Dispensing Principle | Volumetric screw dispensing |
| Wetted‑part Material | Hardened alloy, Stainless steel |
| Viscosity Range | 30,000‑1,300,000 cps |
| Max Cycle Rate | ＞400 cycles/min |
| Minimum Dot Diameter | 0.15 mm |
| Communication | I/O interface, RS232 |
Why Choose TD908A
TD908A features durable washable metal screw instead of disposable plastic consumables, greatly reducing operating cost for mass‑production lines. Independent split fluid‑chamber prevents glue intrusion into motor and extends valve service life. It can realize micro dot down to 0.15 mm and supports high‑speed operation over 400 cycles every minute. I/O and RS232 interfaces support seamless connection with robots and automated equipment. It is an optimal choice for SMT solder paste dotting, chip bonding and continuous production of particle‑loaded adhesives.
