Key Features
Dual‑mode wiping: support needle‑style screw valves and flat‑nozzle piezo jet valves ‑ Optional solvent‑wetting module for stubborn glue such as solder paste, silver paste ‑ Industrial‑grade components, high reliability, improve production uptime ‑ Long‑spec cleaning tape, lower consumption cost, less‑frequent replacement ‑ Low‑power standby mode, instant response upon trigger signal ‑ Wide compatibility range: ultra‑fine needle up to 2 mm large‑size needle and jet‑valve nozzles ‑ Built‑in tape detection sensor: half‑tape indicator, no‑tape alarm lamp & signal output ‑ Tool‑free tape roll replacement for fast maintenance ‑ Adjustable single‑step feeding length of cleaning tape；solvent flow adjustable on wet‑type model ‑ Complete I/O functions: external trigger, manual tape advance, device ready signal, alarm output
Compatible Equipment
TD707A, TD908A, TD‑SE01‑X3, SPEN‑1K(X4), TD500, TDN500E, TPiz600 and other dispensing heads, also match TZ‑S300 visual dispensing machine.
Typical Applications
‑ SMT solder‑paste dispensing, remove solder‑paste residue on needles / nozzles ‑ Semiconductor & consumer‑electronics automatic dispensing production lines ‑ Automotive electronics, new‑energy module dispensing stations ‑ Continuous mass‑production, periodic automatic wiping to stabilize dot consistency
Technical Specifications
| Parameter | Standard TW‑P / TW‑J | Solvent‑Wet TWR‑P / TWR‑J |
|---|---|---|
| Model | TW‑P / TW‑J | TWR‑P / TWR‑J |
| Weight | 1.9 kg | 2.2 kg |
| Dimension(L×H×W) | 193 × 147 × 53 mm | 253 × 147 × 90 mm |
| Cleaning Tape | W15 mm；15 m /35 m optional | W15 mm；15 m /35 m optional |
| Working Air Pressure | 0.3‑0.6 MPa | 0.3‑0.6 MPa |
| Power Supply | DC 24V | DC 24V |
| Applicable Object | Ultra‑fine needle ~ 2 mm needle, jet‑valve flat nozzle | Ultra‑fine needle ~ 2 mm needle, jet‑valve flat nozzle |
Why Choose TW Automatic Needle & Nozzle Wiper
TW wiper is dedicated auxiliary device for automatic dispensing lines. It works for both needle‑mounted screw valves and flat‑nozzle jet valves. Tape‑remaining monitoring outputs alarm signal to host controller. Tool‑free tape replacement cuts maintenance downtime. Optional solvent‑wet module solves cleaning difficulty for stubborn residues like solder paste. Linked by I/O trigger with dispensing program to realize periodic automatic wiping, effectively eliminate hanging glue and nozzle buildup, stabilize dot quality and reduce defect rate.
