TDN500E Light‑Weight Two‑Component Screw Valve

  • Model:TDN500E
  • Drive:DC Servo Motor with 1/108 reducer
  • Mix Ratio:1:1 ~ 1:10 adjustable
  • Viscosity Range:0‑500,000 cps
  • Minimum Dispense Volume:0.0005 ml
  • Dispensing Accuracy:±0.0002 ml
  • Max Shaft Speed:10000 rpm(soft‑shaft anti‑jamming up to 12000 r/min)
  • Input Fluid Pressure:0‑6 kgf/cm²
  • Max Output Pressure:40 kgf/cm²
  • Wetted Parts:SUS304 / FFKM
  • Valve Weight:1.5 kg
  • Working Ambient Temp:10‑40 ℃
  • Max Adhesive Capacity:490 ml
  • Cooling Control:Built‑in cooling block, lowest temperature ‑18℃

TDN500E is a lightweight volumetric two‑component screw dispensing valve. The rotor‑stator pair forms sealed metering chambers. Driven by DC servo motor with reducer, it extrudes adhesive particles to realize stable two‑component proportional output. The drive system adopts soft‑shaft structure to avoid rotor jamming under high‑speed rotation. Rotor is SUS304 with titanium‑coating for high surface finish and wear resistance. Stator core is FFKM die‑cast with SUS304 housing to guarantee precise fitting accuracy.Equipped with built‑in cooling module, dynamically detects and adjusts cooling‑block temperature down to ‑18℃, minimizing temperature interference to dispensing performance. Built‑in miniature check valve prevents cross‑contamination between A‑component and B‑component. It delivers stable mixing ratio and high metering accuracy, effectively eliminates dripping and stringing. Ideal for automated two‑part epoxy, polyurethane and silicone dispensing.

Key Features

  • Positive‑displacement volumetric delivery for two‑component adhesive
  • Closed‑loop DC servo motor with reducer, high‑precision proportional dispensing
  • Soft‑shaft anti‑jamming structure, adapt high‑speed rotation working condition
  • Titanium‑coated SUS304 rotor, FFKM stator for excellent wear‑resistance & corrosion resistance
  • Built‑in cooling control system, temp adjustable down to ‑18℃, reduce ambient temperature impact
  • Built‑in miniature one‑way check valve, effectively prevent A/B glue cross‑flow and cross‑contamination
  • Wide viscosity adaptability, cover low‑viscosity liquid to high‑viscosity paste
  • Stable mixing ratio & outstanding dispensing accuracy, min dispense volume down to 0.0005 ml
  • Effectively suppress dripping and stringing phenomena
  • Light‑weight 1.5 kg body, easy integration for robot and automated platform
  • Adjustable mixing ratio 1:1‑1:10, max glue capacity up to 490 ml

Compatible Materials

Two‑component epoxy resin, PU polyurethane glue, two‑part silicone, double‑component potting compound, thermal conductive adhesive and other dual‑component fluids within wide viscosity range.

Typical Applications

  • Consumer electronics two‑component potting & bonding
  • Automotive electronics sensor sealing and encapsulation
  • New‑energy power module dual‑liquid filling
  • Optoelectronic components precise two‑part dispensing
  • Industrial assembly, multi‑ratio double‑liquid quantitative dispensing process

Technical Specifications

Parameter Specification
Model TDN500E
Drive Motor DC Servo Motor,Reducer ratio 1/108
Mix Ratio Range 1:1 ~ 1:10
Minimum Dispensing Volume 0.0005 ml
Dispensing Accuracy ±0.0002 ml
Viscosity Range 0‑500,000 cps
Rated Motor Speed 10000 rpm;Soft‑shaft max 12000 r/min
Input Fluid Pressure 0‑6 kgf/cm²
Max Output Pressure 40 kgf/cm²
Rotor Material SUS304 with Ti Coating
Stator Core Material FFKM
Wetted‑part Material SUS304 / FFKM
Ambient Operating Temperature 10‑40 ℃
Cooling Block Minimum Temp ‑18 ℃
Valve Weight 1.5 kg
Max Adhesive Capacity 490 ml

Why Choose TDN500E Light‑Weight Two‑Component Screw Valve

TDN500E is volumetric dual‑liquid screw valve for automated dispensing. Servo closed‑loop control ensures stable A/B mixing ratio regardless of pressure fluctuation. Built‑in cooling module suppress glue reaction caused by ambient temperature rise. Internal one‑way check‑valve avoids A/B glue cross‑flow damage. Light‑weight 1.5kg design is friendly for robot mounting. Mixing ratio adjustable 1:1‑1:10, covers multiple dual‑liquid potting and bonding requirements for automotive electronics, new‑energy and consumer‑electronics industries.

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