TCVM Piezo Valve

  • Drive:Piezo‑ceramic actuator
  • Nozzle Orifice:40 μm ~ 500 μm
  • Max Jet Pressure:1000 bar
  • Structure:Split modular design (fluid‑wetted flow‑module + valve‑body module)

TPiz600 piezo jet valve adopts split‑type modular architecture. Components contacting adhesive are integrated as flow‑channel module, while non‑wetted parts form the valve‑body module. Different dispensing requirements can be satisfied simply by swapping flow‑channel modules. Multiple nozzle options and customized striker pin shapes are available to optimize jetting performance. Nozzle types include flat‑jet style, needle‑style and extended‑style with aperture ranging from 40 μm to 500 μm

Product Overview

Wetted assemblies can be fully disassembled within 5 minutes without removing the whole valve from machine. All removable wetted parts support ultrasonic cleaning and even sterilization. Wearing consumable components can be replaced on‑site. Leveraging next‑generation piezo‑ceramic power output, it delivers jet pressure up to 1000 bar, enabling stable dispensing for ultra‑high‑viscosity media. Excellent dot‑to‑dot repeatability is achieved. It supports jetting onto cavities, grooves and irregular surfaces, greatly expanding process capability for complex workpieces。

Key Features

  • Split modular construction: separate flow‑channel module and valve‑body module
  • Quick‑swap flow‑channel module for fast application conversion
  • Three nozzle types:flat‑jet, needle‑type, extended‑type;nozzle bore 40 μm‑500 μm
  • Customizable striker‑pin geometry to tune jetting behaviour
  • Wetted parts fully disassembled within 5 min, no need to demount full valve
  • Removable components support ultrasonic cleaning & sterilization
  • Wearing parts field‑replaceable, reduce downtime
  • Max jet pressure up to 1000 bar, handle ultra‑high‑viscosity fluids
  • High dot‑placement repeatability;adapt for cavity, groove, irregular substrate jetting
  • Matched modular controller, configurable for low‑volume‑high‑mix production scenarios

Compatible Materials

Suitable for broad‑range viscosity fluids, including high‑viscosity pastes, underfill, silver paste, epoxy, sealants, thermal interface materials, UV adhesive and media containing micro solid fillers.

Typical Applications

  • Semiconductor packaging underfill
  • SMT & PCBA precision jet dispensing
  • Automotive electronics, sensor assembly
  • New‑energy power module sealing
  • Complex‑geometry parts: cavities, grooves, irregular surface coating
  • Medical, optoelectronic and micro‑component manufacturing

Technical Specifications

Parameter Specification
Model TPiz600
Drive Unit Piezo‑ceramic actuator
Nozzle Aperture 40 μm ~ 500 μm
Nozzle Versions Flat‑jet / Needle‑style / Extended‑style
Max Jet Pressure 1000 bar
Disassembly Time of Wetted Parts Within 5 minutes
Cleaning Method Ultrasonic cleaning / Sterilization for removable parts
Controller Modular configurable controller unit

Why Choose TPiz600 Piezo Jet Valve

TPiz600 separates wetted flow‑channel components and driving valve‑body into independent modules. Users can switch different processes by replacing flow‑channel assemblies. Wetted parts can be taken apart quickly in‑situ on production equipment within 5 minutes and support ultrasonic cleaning. Wear‑prone components can be changed on‑site without sending valve back for repair. Up to 1000 bar jet pressure enables reliable processing of ultra‑high‑viscosity materials. It can perform stable jetting not only on flat boards but also on cavities, grooves and irregular surfaces. The matching modular controller supports flexible configuration for multi‑variant small‑batch manufacturing needs。

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