Key Features
- Dispensable throw‑away screw assembly，no‑clean quick‑replacement，short change‑over time
- Tool‑free disassembly & cleaning for wetted components，fast product switchover
- Adjustable flow rate；consistent dot dimension for stable production quality
- Supports both dot dispensing & line‑coating process
- Well compatible with particle‑filled fluids such as solder paste and silver paste
- Multiple screw pitch options (1.5/2/3‑pitch,6/8/16‑pitch) for flexible process matching
- I/O signal & RS232 communication interface，convenient for automated system connection
- Light‑weight compact body, easy robot‑mount integration
Compatible Materials
Solder paste, silver paste, SMT red glue, grease, UV adhesive, silicone and other medium‑high‑viscosity fluids containing tiny solid particles.
Typical Applications
- SMT tiny‑dot solder paste dispensing
- Epoxy dispensing & surface‑mount adhesive application
- Bead dispensing, groove & cam cavity filling
- Chip bonding, semiconductor packaging & dam‑and‑fill dam structure dispensing
- Micro top‑side dotting and precision electronics assembly
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | TD707A |
| Dimension(D×H) | 149 × 90 mm |
| Valve Weight | 450 g |
| Fluid Inlet | External‑thread Luer connector |
| Input Voltage | 24VDC |
| Motor | 30W 24VDC，400RPM |
| Viscosity Range | 30,000‑1,300,000 cps |
| Wetted‑part Material | PA66，Delrin，EPDM rubber |
| Screw Pitch | 1.5‑pitch / 2‑pitch /3‑pitch；6‑/8‑/16‑pitch optional |
| Dispensing Mode | Screw volumetric dispensing |
| Communication | I/O interface，RS232 |
Why Choose TD707A Dispensable Screw Valve
TD707A is purpose‑built for solder‑paste and particle‑loaded adhesive dispensing. Its disposable throw‑away screw structure eliminates complex cleaning steps, greatly reduces recipe‑switch downtime. Multiple‑pitch screw options adapt for different dot size and flow‑rate demands. It can perform both dotting and line‑drawing operation. I/O and RS232 interfaces support seamless connection with automated production equipment. Compact lightweight design makes it perfect for SMT, semiconductor packaging and high‑mix‑low‑volume precision electronics manufacturing.
