Brief Introduction
An ultra‑clean micro‑dispensing solution designed for the stringent requirements of semiconductor manufacturing. It covers chip packaging, die attach, and substrate moisture protection, delivering precise, contamination‑free glue application at the micron level to ensure yield, reliability, and long‑term stability of semiconductor devices.
Core Application Processes
- Chip Packaging Automated micro‑dispensing for chip encapsulation and packaging processes. It applies uniform, ultra‑thin adhesive layers with micron‑level accuracy, protecting chips from physical damage and environmental contamination while maintaining package integrity and thermal performance.
- Die Attach Precision dispensing of die‑attach adhesive between the die and substrate or lead frame. Controlled glue volume and placement ensure strong, void‑free bonding, excellent thermal conductivity, and reliable electrical connection, critical for high‑performance semiconductor devices.
- Substrate Moisture Protection Conformal coating and moisture‑barrier dispensing on substrates and circuit surfaces. It forms a uniform protective layer against moisture, dust, and corrosive agents, preventing performance degradation and extending the service life of semiconductor components in harsh operating environments.
Solution Highlights
✅ Ultra‑clean dispensing: Contamination‑free micro‑dispensing at micron‑level precision, meeting semiconductor cleanroom standards
✅ High accuracy & consistency: Precise control over glue volume and dispensing track, minimizing voids and ensuring uniform bonding across high‑volume production
✅ Material compatibility: Supports die‑attach adhesives, encapsulation resins, conformal coatings, and moisture‑barrier materials
✅ Yield improvement: Reduces manual defects and dispensing inconsistencies, boosting production yield and device reliability
✅ Cleanroom integration: Seamlessly integrates into automated semiconductor production lines with cleanroom‑compatible design
