Brief Introduction
High‑precision micro‑dispensing solution tailored for 3C consumer electronics manufacturing. It covers phone frame bonding, camera encapsulation and battery cushioning. Realize micro‑volume, high‑uniformity glue application to meet compact assembly requirements of smartphones, tablets and wearable devices, enhancing product bonding strength, shock resistance and sealing reliability.
Core Application Processes
- Phone Frame Bonding Precision dispensing for mobile phone middle frame, back cover and display assembly. Form thin and stable adhesive joints. Deliver reliable bonding strength while satisfying narrow‑gap assembly demands. Prevent glue overflow onto appearance surfaces. Support high‑speed mass production of consumer handsets.
- Camera Encapsulation Micro‑dispensing for camera module lens, sensor and housing. Complete encapsulation and sealing protection. Block dust and moisture entering the optical system. Guarantee imaging stability. Fine glue volume control avoids contamination to optical components.
- Battery Cushioning Dispensing cushioning adhesive for built‑in batteries of consumer devices. Form soft buffer adhesive layer between battery and housing. Absorb impact force during drop and vibration. Prevent battery collision damage, improve product safety performance.
Solution Highlights
✅ Micro‑volume high precision: Micron‑level dispensing accuracy, suitable for narrow‑gap compact 3C product assembly
✅ Appearance‑friendly performance: Strictly control glue overflow, keep product surface clean for high‑end consumer electronics
✅ Diverse glue adaptability: Compatible with structural adhesive, optical encapsulation glue, cushion foam glue and sealants
✅ High‑speed production matching: Integrate into 3C automated assembly lines, stable performance for large‑batch manufacturing
✅ Product reliability upgrade: Improve bonding, shock‑absorbing and dust‑proof performance for finished consumer devices
